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Comparing Ordinary AOI and Online AOI for SMT Assembly Use
10 Jun, 2025
Key Takeaways Understanding Ordinary AOI and Online AOI in SMT Assembly Use What Is Ordinary AOI? Ordinary AOI (Automated Optical Inspection) performs offline PCB inspection after production. It uses cameras to detect defects like missing components or soldering issues, ideal for small batches or prototype testing. Aspect Description Measurement Uncertainty ±0.4mil accuracy for defect detection… Continue reading Comparing Ordinary AOI and Online AOI for SMT Assembly Use
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Best Practices for SMT Line Optimization in PCBA Manufacturing
10 Jun, 2025
Key Takeaways Understanding SMT Line Optimization in PCBA Processing What Is SMT Line Optimization? SMT line optimization enhances Surface Mount Technology workflows to reduce waste, improve machine efficiency, and standardize processes. It involves: Why Is Optimization Critical? Performance Metrics: Improvement Type Impact Just-in-time material buying Cuts costs by 8–15% First-pass yield improvements Reduces rework costs… Continue reading Best Practices for SMT Line Optimization in PCBA Manufacturing
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The Role of SPI Visual Inspection After SMT Solder Paste Screen Printing in PCBA Production
10 Jun, 2025
Key Takeaways Understanding SPI Visual Inspection in PCBA Production What Is SPI and Why Is It Essential? SPI (Solder Paste Inspection) systems verify solder paste quality post-printing, measuring parameters like height, volume, and placement. This is critical because: Role in Ensuring Solder Paste Quality SPI systems evaluate: Function Description Height Measurement Ensures consistent paste thickness… Continue reading The Role of SPI Visual Inspection After SMT Solder Paste Screen Printing in PCBA Production
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Key Points for Quality Control of Solder Paste Screen Printing in SMT Production
10 Jun, 2025
Key Takeaways Common Challenges in Solder Paste Screen Printing Misalignment Issues Insufficient Deposition Excessive Paste and Smudging Stencil Clogging and Wear Environmental Factors Key Parameters for Quality Control Stencil Alignment Snap-Off Settings Separation Distance & Speed Parameter Recommended Value Separation Distance 0.010″–0.050″ (0.25–1.25 mm) Separation Speed 0.010″–0.020″/sec (0.254–0.508 mm) Print Speed Squeegee Pressure & Angle… Continue reading Key Points for Quality Control of Solder Paste Screen Printing in SMT Production
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How the Quality of Solder Paste Affects SMT Soldering Quality of PCB Boards
10 Jun, 2025
Key Takeaways Key Properties of Solder Paste Influencing Soldering Quality Viscosity and Stencil Printing Impact Particle Size and Distribution Performance Attribute Effect of Solder Powder Size Shelf Life Varies Stencil Life Varies Reflow Performance Varies Metal Content and Joint Strength Flux Composition and Oxidation Prevention Factors Affecting Solder Paste Quality Storage Conditions Storage Condition Temperature… Continue reading How the Quality of Solder Paste Affects SMT Soldering Quality of PCB Boards
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How Reflow Soldering Temperature Zones Impact PCB Quality
10 Jun, 2025
CONTENTS Key Takeaways The Four Temperature Zones in Reflow Soldering Preheat Zone: Gradual Temperature Ramping Soak Zone: Flux Activation and Heat Distribution Reflow Zone: Solder Melting Cooling Zone: Solder Solidification Impact of Temperature Zones on PCB Quality Common Defect Prevention Temperature (°C) Effect on PCB ≤550 No major damage 640 Initial damage ≥740 Severe damage… Continue reading How Reflow Soldering Temperature Zones Impact PCB Quality
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