5G PCB Materials: The Key to High-Frequency and High-Speed

Discover the critical role of PCB materials in 5G system design. Learn how dielectric properties, thermal management, and material selection impact signal integrity. Includes detailed comparison tables of amplifier, antenna, and high-speed module PCB substrates.

Introduction

The arrival of 5G technology has transformed wireless communication, requiring electronic systems to operate at higher frequencies and faster data rates than ever before. At the heart of this transformation lies PCB materials—the foundation of 5G circuits. Selecting the right substrate is essential to ensuring low signal loss, stable thermal performance, and reliable high-frequency transmission.

This article explores the critical material properties for 5G PCB design and provides comprehensive reference tables for amplifier, antenna, and high-speed module substrates widely used in the industry.

Why PCB Materials Matter in 5G Design

Unlike traditional circuits, 5G systems combine high-speed digital and high-frequency RF signals, making them highly susceptible to electromagnetic interference (EMI). Material selection directly impacts signal integrity, dielectric stability, and heat dissipation.

Key factors to consider include:
1. Dielectric Constant (Dk): Lower Dk materials reduce signal delay and dispersion.
2. Dissipation Factor (Df): A low Df minimizes energy loss, crucial for GHz-level frequencies.
3. Thermal Conductivity: Effective heat dissipation ensures stable system performance.
4. Thermal Coefficient of Dielectric Constant (TCDk): Prevents dielectric property shifts under temperature changes.

Best Practices in 5G PCB Design

– Impedance Control: Maintain consistent trace impedance across interconnects.
– Short Signal Paths: RF traces should be as short as possible.
– Precise Conductor Geometry: Trace width and spacing must be tightly controlled.
– Material Matching: Use substrates optimized for their intended function (amplifier, antenna, or module).

5G PCB Material Reference Tables

1. 5G Amplifier PCB Materials

Material Brand	Type	Thickness (mm)	Panel Size	Origin	Dk	Df	Composition
Rogers	R03003	0.127–1.524	12”×18”, 18”×24”	Suzhou, China	3.00	0.0012	PTFE + Ceramic
Rogers	R04350	0.168–1.524	12”×18”, 18”×24”	Suzhou, China	3.48	0.0037	Hydrocarbon + Ceramic
Panasonic	R5575	0.102–0.762	48”×36”, 48”×42”	Guangzhou, China	3.6	0.0048	PPO
FSD	888T	0.508–0.762	48”×36”	Suzhou, China	3.48	0.0020	Nanoceramic
Sytech	Mmwave77	0.127–0.762	36”×48”	Dongguan, China	3.57	0.0036	PTFE
TUC	Tu-1300E	0.508–1.524	36”×48”, 42”×48”	Suzhou, China	3.06	0.0027	Hydrocarbon
Ventec	VT-870 L300	0.08–1.524	48”×36”, 48”×42”	Suzhou, China	3.00	0.0027	Hydrocarbon
Ventec	VT-870 H348	0.08–1.524	48”×36”, 48”×42”	Suzhou, China	3.48	0.0037	Hydrocarbon
Rogers	4730JXR	0.034–0.780	36”×48”, 42”×48”	Suzhou, China	3.00	0.0027	Hydrocarbon + Ceramic
Rogers	4730G3	0.145–1.524	12”×18”, 42”×48”	Suzhou, China	3.00	0.0029	Hydrocarbon + Ceramic

 

 

2. 5G Antenna PCB Materials

Material Brand	Type	Thickness (mm)	Panel Size	Origin	Dk	Df	Composition
Panasonic	R5575	0.102–0.762	48”×36”, 48”×42”	Guangzhou, China	3.6	0.0048	PPO
FSD	888T	0.508–0.762	48”×36”	Suzhou, China	3.48	0.0020	Nanoceramic
Sytech	Mmwave500	0.203–1.524	36”×48”, 42”×48”	Dongguan, China	3.00	0.0031	PPO
TUC	TU-1300N	0.508–1.524	36”×48”, 42”×48”	Taiwan, China	3.15	0.0021	Hydrocarbon
Ventec	VT-870 L300	0.508–1.524	48”×36”, 48”×42”	Suzhou, China	3.00	0.0027	Hydrocarbon
Ventec	VT-870 L330	0.508–1.524	48”×42”	Suzhou, China	3.30	0.0025	Hydrocarbon
Ventec	VT-870 H348	0.08–1.524	48”×36”, 48”×42”	Suzhou, China	3.48	0.0037	Hydrocarbon

 

 

 

3. 5G High-Speed Module PCB Materials

Material Brand	Type	Thickness (mm)	Panel Size	Origin	Dk	Df	Composition
Rogers	4835T	0.064–0.101	12”×18”, 18”×24”	Suzhou, China	3.33	0.0030	Hydrocarbon + Ceramic
Panasonic	R5575G	0.05–0.75	48”×36”, 48”×42”	Guangzhou, China	3.6	0.0040	PPO
Panasonic	R5585GN	0.05–0.75	48”×36”, 48”×42”	Guangzhou, China	3.95	0.0020	PPO
Panasonic	R5375N	0.05–0.75	48”×36”, 48”×42”	Guangzhou, China	3.35	0.0027	PPO
FSD	888T	0.508–0.762	48”×36”	Suzhou, China	3.48	0.0020	Nanoceramic
Sytech	S6	0.05–2.0	48”×36”, 48”×40”	Dongguan, China	3.58	0.0036	Hydrocarbon
Sytech	S6N	0.05–2.0	48”×36”, 48”×42”	Dongguan, China	3.25	0.0024	Hydrocarbon

 

Conclusion

The transition to 5G networks demands more than just faster processors and advanced antennas—it requires optimized PCB materials tailored to specific system functions. Whether in amplifiers, antennas, or high-speed modules, low-loss, thermally stable substrates are the foundation of reliable 5G performance.

By carefully selecting materials based on Dk, Df, and thermal properties, engineers can build circuit boards that ensure robust, high-frequency, and high-speed performance—meeting the demands of next-generation wireless communication.