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Top 10 PCB Packaging Types Used in Modern Electronic Devices(Part 2)
14 Oct, 2025
QFN (Quad Flat No-lead) Overview You see QFN in many new electronics today. This package is flat and square. It does not have leads sticking out. Metal pads are under the chip. QFN sits close to the PCB. This helps make devices smaller and lighter. The pad on the bottom helps move heat away. This… Continue reading Top 10 PCB Packaging Types Used in Modern Electronic Devices(Part 2)
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Top 10 PCB Packaging Types Used in Modern Electronic Devices(Part 1)
14 Oct, 2025
You can find the top ten mainstream electronic device packaging types of PCB used in today’s electronics. These packaging types include Surface Mount, Through-Hole, Hybrid Packaging, and more. The packaging you choose can affect the overall size of the device, improve its performance, and speed up the manufacturing process. For instance, surface mount technology enables the creation… Continue reading Top 10 PCB Packaging Types Used in Modern Electronic Devices(Part 1)
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Optimizing HDI PCB Assembly: Key Steps & LTPCBA’s Expert Solutions for High-Density Designs
14 Oct, 2025
In today’s era of miniaturized, high-performance electronics—from 5G routers and wearable health monitors to aerospace sensors and medical imaging devices—High-Density Interconnect (HDI) PCBs have become indispensable. Their ability to pack more components and connections into smaller spaces, while delivering faster signal speeds and better reliability, makes them a cornerstone of modern design. However, optimizing HDI… Continue reading Optimizing HDI PCB Assembly: Key Steps & LTPCBA’s Expert Solutions for High-Density Designs
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Heavy Copper vs Standard PCB Assembly: LTPCBA’s Optimal Solutions
13 Oct, 2025
When selecting a PCB assembly for your project，whether it’s a everyday consumer device or a high-power industrial system—the choice between heavy copper and standard PCBs defines performance, reliability, and cost-effectiveness. At LTPCBA, we’ve spent decades mastering both technologies, helping clients navigate tradeoffs between current capacity, thermal management, and manufacturing feasibility. This guide breaks down the… Continue reading Heavy Copper vs Standard PCB Assembly: LTPCBA’s Optimal Solutions
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Step-by-Step Guide to Assembling Rogers PCBs for High-Frequency Applications | LTPCBA Expert Insights
13 Oct, 2025
High-frequency applications—from telecom infrastructure and automotive radar to aerospace systems and medical devices—demand printed circuit boards (PCBs) that deliver uncompromised signal integrity, thermal stability, and reliability. For these critical use cases, Rogers PCBs stand out as the gold standard, thanks to their exceptional dielectric properties and mechanical robustness. However, assembling Rogers PCBs for high-frequency scenarios… Continue reading Step-by-Step Guide to Assembling Rogers PCBs for High-Frequency Applications | LTPCBA Expert Insights
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A Step-by-Step Guide to Through-Hole PCB Assembly: From Preparation to Final Testing
13 Oct, 2025
Through-hole PCB assembly remains a cornerstone of reliable electronics manufacturing, valued for its robust mechanical bonds and ability to withstand harsh conditions—from industrial vibration to automotive under-hood heat. Unlike surface-mount technology (SMT), which attaches components to the PCB surface, through-hole assembly involves inserting component leads through pre-drilled holes and soldering them to create permanent electrical… Continue reading A Step-by-Step Guide to Through-Hole PCB Assembly: From Preparation to Final Testing
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