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Surface Mount Technology (SMT) mounts components directly on PCB surfaces, enabling miniaturized designs. Automated pick-and-place machines achieve precision placement (±25μm) for components as small as 01005 (0.4mm x 0.2mm).
Industry Standard | Scope |
IPC-A-610 | Solder joint quality and component placement |
IPC-J-STD-001 | Soldering processes and cleanliness |
IPC-7351 | Component footprint design guidelines |
THT inserts leaded components through drilled holes, creating robust mechanical bonds via wave soldering. It suits large components (transformers, power resistors) and harsh environments.
THT Advantage | Application Scenario |
High vibration resistance | Aerospace avionics |
High-power handling | Industrial motor controls |
Ease of manual repair | Educational prototypes |
Advantages:
Feature | Benefit |
Component density | Supports 4+ layer PCBs with blind vias |
Assembly automation | Minimizes human error |
High-volume scalability | Ideal for consumer electronics |
Challenges:
Advantages:
Performance Metric | THT Edge |
Thermal stability | Operates reliably at 150°C |
Vibration resistance | 20–2000Hz tolerance |
Electrical conductivity | Lower contact resistance |
Challenges:
THT is critical for:
Technology | Low Volume (<100 units) | High Volume (>5,000 units) |
THT | 5–10/unit (low setup cost) | 15–20/unit (high labor) |
SMT | 10–15/unit (high setup) | 2–5/unit (automation savings) |
Hybrid Benefit | Technical Impact |
Design flexibility | Combines dense layouts with robust components |
Cost optimization | Uses THT only where necessary |
Performance balance | High-speed signals with high-power handling |
Yes—hybrid PCBs integrate SMT for miniaturization and THT for durability, common in aerospace and telecom gear.
THT, due to its larger lead spacing (reduces arcing) and better heat dissipation for >500V circuits.
THT is ideal for prototypes: easier manual soldering, component replacement, and lower setup costs.
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