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Aspect | Considerations |
Material | FR-4 for cost-performance balance; high-Dk materials for high-frequency circuits. |
Thickness | 0.8–1.6mm standard; thicker boards (2.0mm) for heavy components. |
Trade-off | Thin boards excel in signal integrity; thick boards offer better thermal dissipation. |
Testing Method | Focus Area |
In-circuit | Test pad accessibility |
Flying probe | Component lead exposure |
Trace Type | Recommended Spacing |
High current | 3–4x trace width |
Power | 4–5x trace width |
Cause | Solution |
Uneven layers | Stress relief after lamination |
Copper frame design | Segmented frames over solid ones |
Metric | Performance Range |
Order Fulfillment Rate | 90–98% |
First Pass Yield | 95–98% |
On-Time Delivery | 90–98% |
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