2D X-ray provides single-plane imaging, while 3D X-ray (AXI) generates cross-sectional views via computed tomography (CT).
Evolution of X-ray in Electronics Manufacturing
Generation
Technology
Resolution
Application Scope
1st
2D Transmission
5–10μm
Basic solder joint check
2nd
3D Tomography
1–5μm
BGA/CSP defect detection
3rd
3D Volumetric
<1μm
Fine-pitch component analysis
The Critical Role of X-ray in SMT Assembly
Defect Detection in Hidden Joints
BGA/CSP Inspection: Detects voids, head-in-pillow (HiP) defects, and incomplete wetting.
Through-Hole Joints: Verifies solder fill in via holes (IPC-A-610 Class 3 requires ≥75% fill).
Process Validation and Monitoring
Reflow Profile Optimization: Analyzes solder joint formation under different temperature profiles.
Design for Manufacturability (DFM): Identifies thermal relief issues before mass production.
Compliance with Stringent Standards
Aerospace/Military: Meets MIL-STD-883H for hermetic seal verification.
Medical Devices: Ensures ISO 13485 compliance for implantable devices.
Key Benefits of X-ray Inspection
Improved Quality and Reliability
Defect Type
Detection Rate
Impact on Yield
BGA Voids
99.7%
+15% yield boost
Solder Bridges
98.5%
+10% yield boost
Misaligned Components
99.2%
+12% yield boost
Cost Savings Through Early Defect Detection
Rework Reduction: Saves 2.50–5.00 per PCB by catching defects before final test.
Material Waste: Reduces scrap rates by 30% in high-density assemblies.
Enhanced Process Control
Statistical Process Control (SPC): Monitors defect trends to optimize production parameters.
Root Cause Analysis (RCA): Links defects to specific process steps (e.g., reflow temperature spikes).
X-ray Inspection Techniques and Equipment
2D vs. 3D X-ray Systems
Feature
2D X-ray
3D X-ray (AXI)
Imaging Type
Single-plane
Cross-sectional/3D volume
Resolution
5–10μm
1–5μm (sub-micron in premium systems)
Inspection Speed
Faster (5–10 sec/board)
Slower (30–60 sec/board)
Cost
Lower
Higher
Advanced X-ray Technologies
Computed Tomography (CT): Creates 3D models for complex assemblies.
Micro-focus X-ray: Achieves <1μm resolution for fine-pitch BGAs (0.3mm pitch and below).
Dual-energy X-ray: Differentiates between solder and copper for void analysis.
LTPCBA's Expertise in X-ray for SMT Processing
State-of-the-Art Equipment
3D AXI Systems: Nikon XT V 160 with 2μm resolution for medical device PCBs.
Micro-focus X-ray: Yxlon FF35 for aerospace-grade BGA inspection.
Quality Metrics
Metric
LTPCBA Performance
Defect Detection Rate
99.8%
False Alarm Rate
<5%
Inspection Throughput
120 boards/hour
Industry-Specific Solutions
Automotive: X-ray validation of ADAS PCBs for thermal cycling reliability.
5G Telecom: 3D X-ray of mmWave antenna modules for signal integrity.
IoT Wearables: Micro-focus X-ray of flexible PCBs for bend durability.
FAQ
How does X-ray inspection differ from AOI?X-ray sees through components to inspect hidden joints, while AOI checks surface defects. Both complement each other in comprehensive quality control.
Is X-ray inspection safe for electronic components?Yes—modern X-ray systems use low-dose radiation (<1mSv/inspection), well below IEC 61967 safety limits for components.
Can X-ray detect all SMT defects?X-ray excels at hidden joint defects but may miss surface-level issues like component tombstoning, which are better caught by AOI.