AMD Adds UCIe to Versal RF SoCs for Multi-Terabit Chiplet Links

AMD is adding native UCIe 1.1 connectivity to selected Versal RF adaptive SoCs, enabling direct die-to-die links with specialized chiplets inside the same package. The move, reported by EE News Europe, targets multi-terabit-per-second aggregate bandwidth for chiplet-based RF, AI, networking and communications systems.

UCIe, or Universal Chiplet Interconnect Express, is emerging as the standard for connecting heterogeneous chiplets in advanced packages. By integrating the interface natively into Versal RF SoCs, AMD eliminates the need for external bridge chips and reduces latency and power while improving signal integrity. The Versal RF family targets applications such as phased-array radar, 5G/6G infrastructure, satellite communications and AI-driven RF systems. Native UCIe 1.1 support allows system designers to mix RF, digital and memory chiplets from different vendors in a single package, with aggregate bandwidth reaching multiple terabits per second. This approach accelerates time to market for specialized systems and aligns with the chiplet model already used by AMD in its data center processors.

For PCB and PCBA buyers, AMD’s move signals tighter integration between silicon and advanced packages. Chiplet-based designs require high-density interconnect substrates, fine-line multilayer PCBs and rigorous signal integrity control. The UCIe interface uses microbumps or hybrid bonding at pitches down to 25 microns, pushing fabricators toward substrate-like PCB (SLP) processes and advanced HDI capabilities. As more RF and AI systems adopt chiplet architectures, demand rises for high-layer-count boards, low-loss materials and precision SMT assembly. Data centers, 5G base stations and military radar programs will need suppliers that can handle mixed-pitch assembly and thermal management for multi-die packages. This development also accelerates the shift away from monolithic SoCs, affecting long-term component sourcing and board design strategies.

For OEM buyers evaluating chiplet-based designs, LT CIRCUIT supplies high-layer-count HDI boards, substrate-like PCBs and IC substrates that support the fine-line routing and signal integrity demands of UCIe-based packages. Our rigid-flex and heavy copper options also address the mixed-pitch assembly and thermal challenges of multi-die RF and AI modules.