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US-China Tariffs Push PCB Buyers Toward ‘China Plus One’ Sourcing
04 9 月, 2026
US-China tariff swings are pushing OEMs toward 'China Plus One' PCB sourcing, with dual qualification and Southeast Asia capacity gaining ground in 2025.
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Europe Chips Act 2.0 Bets on Power, Auto Chips
03 9 月, 2026
Europe Chips Act 2.0 shifts focus to semiconductor equipment, power electronics, and automotive chips, raising demand for heavy copper, IMS, and ceramic PCBs in EV and industrial designs.
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NVIDIA AI Server Demand Fuels HDI, High-Layer PCB Order Surge
01 9 月, 2026
NVIDIA AI server demand is fueling record orders for HDI and high-layer-count PCBs. Capacity is tight—see what OEM buyers must do to secure supply.
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Apple PCB Shift: Zhen Ding, Compeq Build Thai HDI Capacity
31 8 月, 2026
Apple's PCB supply chain shifts to Thailand and Malaysia in 2025 as Zhen Ding and Compeq build HDI capacity. See which suppliers are winning new orders.
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NVIDIA AI Server Demand Drives HDI, High-Layer PCB Orders
25 8 月, 2026
NVIDIA AI server demand is surging HDI and high-layer-count PCB orders, tightening supply and shifting capacity. See what it means for buyers.
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EU Chips Act 2.0 Push Targets 20% Global Chip Share by 2030
13 8 月, 2026
EU readies Chips Act 2.0 after auditors say 20% chip share target is slipping. Impact on semiconductor, PCB, and advanced packaging supply chains.
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