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Key Points for Quality Control of Solder Paste Screen Printing in SMT Production
10 Jun, 2025
Key Takeaways Common Challenges in Solder Paste Screen Printing Misalignment Issues Insufficient Deposition Excessive Paste and Smudging Stencil Clogging and Wear Environmental Factors Key Parameters for Quality Control Stencil Alignment Snap-Off Settings Separation Distance & Speed Parameter Recommended Value Separation Distance 0.010″–0.050″ (0.25–1.25 mm) Separation Speed 0.010″–0.020″/sec (0.254–0.508 mm) Print Speed Squeegee Pressure & Angle… Continue reading Key Points for Quality Control of Solder Paste Screen Printing in SMT Production
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How the Quality of Solder Paste Affects SMT Soldering Quality of PCB Boards
10 Jun, 2025
Key Takeaways Key Properties of Solder Paste Influencing Soldering Quality Viscosity and Stencil Printing Impact Particle Size and Distribution Performance Attribute Effect of Solder Powder Size Shelf Life Varies Stencil Life Varies Reflow Performance Varies Metal Content and Joint Strength Flux Composition and Oxidation Prevention Factors Affecting Solder Paste Quality Storage Conditions Storage Condition Temperature… Continue reading How the Quality of Solder Paste Affects SMT Soldering Quality of PCB Boards
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How Reflow Soldering Temperature Zones Impact PCB Quality
10 Jun, 2025
CONTENTS Key Takeaways The Four Temperature Zones in Reflow Soldering Preheat Zone: Gradual Temperature Ramping Soak Zone: Flux Activation and Heat Distribution Reflow Zone: Solder Melting Cooling Zone: Solder Solidification Impact of Temperature Zones on PCB Quality Common Defect Prevention Temperature (°C) Effect on PCB ≤550 No major damage 640 Initial damage ≥740 Severe damage… Continue reading How Reflow Soldering Temperature Zones Impact PCB Quality
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Understanding the Pros and Cons of SMD and Through-Hole Technology
10 Jun, 2025
CONTENTS Key Takeaways Advantages of Surface Mount Technology Small Size and Lightweight Design SMT places components directly on the PCB surface, eliminating the need for drilled holes. This allows: Fast Assembly with Automation Automated SMT systems enable high-volume production: Metric Value Market Share (2023) 46.66% Market Value USD 2,707.03 Million Projected CAGR 8.50% Cost Efficiency… Continue reading Understanding the Pros and Cons of SMD and Through-Hole Technology
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SMT and DIP Assembly Explained for PCBA Applications
10 Jun, 2025
CONTENTS Key Takeaways Understanding DIP Assembly in PCBA How DIP Assembly Works DIP (Dual In-line Package) uses components with two rows of pins inserted into pre-drilled PCB holes. Key steps include: Wave soldering is critical for durable joints, making DIP suitable for high-stress environments. Advantages of DIP Assembly Disadvantages of DIP Assembly Exploring SMT Assembly for… Continue reading SMT and DIP Assembly Explained for PCBA Applications
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What Is Full Turn-Key PCB Manufacturing and Assembly
10 Jun, 2025
CONTENTS Key Takeaways What Does a Full Turn-Key PCB Manufacturer Offer? PCB Design and Prototyping Quality Assurance Steps: Evidence Type Description Data Collection Monitor critical dimensions post-production Process Capability Studies Analyze tool wear and operator impact Continuous Improvement Refine tolerances with manufacturing feedback Component Sourcing and Procurement PCB Fabrication and Assembly Turnkey vs. Traditional Processes:… Continue reading What Is Full Turn-Key PCB Manufacturing and Assembly
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