BIWIN Partners with Brazil’s Tera for Memory Packaging Surge

China’s BIWIN Semiconductor and Brazil’s Tera Indústria de Semicondutores signed a strategic partnership on August 6, 2026, to jointly manufacture and distribute memory and storage solutions, targeting the Brazilian market and strengthening diversified semiconductor supply chains.

Under the agreement, BIWIN and Tera will combine BIWIN’s advanced memory packaging technology with Tera’s local manufacturing footprint in Manaus, Brazil. The partnership aims to ramp up production of DRAM modules, SSDs, and embedded storage products, initially for the Brazilian market, with potential expansion across Latin America. The move aligns with growing global efforts to establish regional semiconductor hubs, reducing reliance on traditional Asian production centers.

The deal underscores the increasing importance of advanced packaging in the memory sector, where compact, high-performance designs demand sophisticated PCB and substrate technologies. For electronics manufacturers, this signals more localized memory component sourcing, potentially easing supply chain bottlenecks. As the partnership progresses, demand for high-density interconnect (HDI) PCBs, IC substrates, and related assembly services is expected to rise, supporting the region’s electronics ecosystem.

LT CIRCUIT, a manufacturer of advanced PCBs including HDI, IC substrates, and rigid-flex solutions, sees growing opportunities in memory packaging and semiconductor applications. The BIWIN-Tera partnership highlights the need for reliable, high-layer-count boards and precise SMT assembly, areas where LT CIRCUIT provides critical support to global electronics supply chains.