Foxconn, Luxshare Ramp PCBA Capacity as AI Server Orders Surge

Foxconn and Luxshare are racing to add PCB assembly and SMT capacity this quarter, with new lines and plants going in across Taiwan, Vietnam, Mexico, India and the United States. The push is driven by surging AI server rack orders tied to NVIDIA’s platform and steadier Apple volumes, tightening available EMS capacity for other electronics OEMs worldwide.

Foxconn, the world’s largest contract manufacturer, is leading the ramp. Management has guided AI server revenue to double in 2025 and expects AI products to reach roughly half of its server business, prompting expanded SMT lines and new assembly plants in Taiwan, Mexico, Vietnam and the United States. The Texas site is being positioned for GB-series rack-scale integration on US soil, while Mexican plants serve nearshore data center demand. Each AI rack consumes dense high-layer-count boards, substrate-like PCBs, heavy copper power boards and complex cable-and-module assembly — multiplying PCB content per system several times over a traditional server and pulling advanced substrate supply toward the biggest assemblers.

Luxshare is moving in parallel. The Apple assembler has absorbed Wingtech’s product-integration business, enlarged its Bac Giang campus in Vietnam and grown communications plus data center revenue by double digits, its fastest-rising segment outside consumer devices. New PCBA lines target optical modules, power electronics and automotive controllers, deliberately reducing reliance on any single customer. For OEM buyers, the combined expansion signals sharper competition for high-end SMT slots and for constrained inputs such as IC substrates, ABF and large-format multilayer boards. Procurement teams should expect longer qualification queues and firmer pricing into next quarter, as AI-driven volume crowds conventional capacity and redirects board supply toward top-tier assemblers.

As AI racks and EV programs absorb more tier-one EMS capacity, LT CIRCUIT helps OEM buyers stay on schedule with high-layer-count PCBs, substrate-like PCBs, HDI, heavy copper and rigid-flex boards engineered for demanding signal-integrity and thermal requirements — securing board supply while major assembly lines stay booked with AI work.