IoT Surge Drives PCB Innovation as The Things Conference 2026 Returns

The Things Conference 2026, scheduled for September 22–23 in Amsterdam, expects over 2,000 attendees from 80+ countries to showcase live IoT demos, highlighting accelerating demand for advanced PCBs in connected devices.

Under the slogan ‘Put Your Demo Where Your Mouth Is,’ the two-day event moves beyond slides to tangible prototypes, reinforcing a shift toward production-ready IoT hardware. Organizers anticipate a 25% larger crowd than previous editions, with engineers and OEMs comparing notes on edge AI, low-power design, and sensor integration—all of which lean heavily on compact, high-reliability circuitry.

For PCB and PCBA buyers, the conference signals a growing pipeline of designs requiring HDI, rigid-flex, and IC substrate boards. IoT’s push into industrial, medical, and smart-city applications demands denser interconnects and thinner form factors, making the event a bellwether for upcoming RFQs in multi-layer and ceramic substrates.

As IoT hardware moves from concept to scale, manufacturers like LT CIRCUIT stand ready to support with HDI, rigid-flex, and IC substrate PCBs that meet the miniaturization and reliability needs of next-gen connected devices.