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A new EE Times white paper details how server-grade automated optical inspection (AOI) systems now achieve 100Gbps image acquisition, a critical leap to meet inspection demands from NVIDIA and TSMC as AI chip production scales rapidly.
The paper outlines a server-grade architecture integrating high-speed frame grabbers, GPU computing, and PCIe Gen4/5 interconnects to sustain reliable 100Gbps throughput. This overcomes thermal and bandwidth bottlenecks, enabling real-time AI-powered defect detection at sub-micron resolutions on wafers and advanced packages.
With AI chips for hyperscale data centers and HPC driving wafer volumes higher, 100Gbps AOI systems reduce inspection time and improve yield. The technology is pivotal for 3D stacking, chiplets, and HBM integration, where a single undetected defect can scrap entire multi-thousand-dollar packages.
As AI chip production intensifies, demand for high-reliability IC substrates and HDI PCBs—core products from LT CIRCUIT—grows. Advanced AOI ensures the quality of these complex boards used in semiconductor packaging and test, aligning with the 100Gbps inspection trend.
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