θ-TaN Material Surpasses Copper’s Thermal Conductivity by 3x for Chips

Researchers have unveiled θ-TaN, a metallic material boasting nearly three times the thermal conductivity of copper, promising to transform chip cooling. Reported recently, the breakthrough targets thermal bottlenecks in AI accelerators, data center processors, and high-performance computing, where excessive heat hampers performance and drives up energy costs for advanced PCB assemblies.

The metastable phase of tantalum nitride (θ-TaN) achieves a thermal conductivity of ~1,100 W/m·K, far outpacing copper’s ~400 W/m·K. Deposited as a thin film directly onto chip packaging substrates, it efficiently draws heat away from hotspots. This performance leap is critical as processor power densities escalate, with some AI chips now exceeding 500 W. By integrating θ-TaN into thermal interface materials and heat spreaders, manufacturers can enable thinner, more reliable multilayer PCB designs without compromising cooling capacity.

As OEMs push for higher integration in HDI and IC substrate PCBs, thermal management becomes the limiting factor. The adoption of θ-TaN could slash junction temperatures by 20–30°C, extending device lifespan and unlocking further miniaturization. For rigid-flex and ceramic PCB assemblies used in EV power modules and RF systems, this material may soon displace copper interlayers, aligning with the industry’s shift toward advanced packaging for 5G, AI, and automotive electronics.

LT CIRCUIT’s expertise in IC substrate PCBs and thermal-heavy designs like IMS and heavy copper boards positions it to leverage such innovations. As θ-TaN moves toward production, our HDI any-layer and ceramic PCB solutions will readily incorporate new cooling layers to meet OEM demands for AI and EV reliability.