USB-C Power Delivery Surge Drives HDI PCB Demand

Elektor’s Lab Talk #49 on August 6, 2026, will examine USB-C charging and mobile power measurement, highlighting the rapid adoption of USB Power Delivery (PD) that is pushing PCB designs toward higher complexity and density.

As USB-C becomes the universal connector—driven by EU mandates and rising power levels up to 240W—consumer electronics engineers must address tighter voltage regulation, higher current, and thermal challenges. This shift increases reliance on HDI, multilayer, and rigid-flex PCBs to achieve compact, high-performance layouts.

The free webinar will offer practical measurement insights, but the broader industry trend is clear: shrinking device form factors and multi-function USB-C ports are fueling demand for advanced PCB substrates. Designers are now specifying HDI any-layer and substrate-like PCBs to meet signal integrity and space requirements in mobile power applications.

For OEMs developing next-gen USB-C devices, LT CIRCUIT supplies the HDI, rigid-flex, and multilayer PCBs essential for compact, high-power designs.